Latest News
Standardizing FPGA: Findings and next steps
Munich, July 2023 – Looking back at this year's FPGA Conference Europe, we have gained a lot of insights on standardizing FPGA. There is a broad consensus in the FPGA market, that there is a need for something to standardize FPGA to some extent. Not only for hardware, but also for configuration and software. Which is exactly what we as SGET have been working on for the last 18 [...]
Open Standard Module with initial Design Guide release
Munich, May 2022 – SGET announces two important innovations for its solder-on module standard, which was launched in 2019: On the one hand, the new specification in version 1.1 with many backward-compatible improvements and future-proof extensions. And on the other hand, the first design guide with practical tips and information on the design-in of OSM modules. With the Open Standard Module (OSM) standard published in 2021, the Standardization Group for [...]
SGET releases new Design Guide 2.1.1 for SMARC carrier boards: Extended connectivity for Arm and x86
Munich, Germany, 1 June 2021: SGET e.V. – a technical consortium hosting and developing specifications for embedded computer technology – has released the new design guide for its latest SMARC 2.1.1 specification. It offers embedded systems developers comprehensive design guidance for SMARC based carrier boards and now covers all features and interfaces that were implemented with the recent SMARC specification update. The new specification gives designers freedom with regards to [...]
SGET announces new chairman and sets sail for a new decade
Munich, June 2021 – SGET, an international not-for-profit association of companies and organizations that collaboratively develop independent specifications for embedded computer technology, held its triennial management board election. The group elected a new chairman and re-elected four members of the board to lead the association through 2024. At the annual general meeting of the Standardization Group for Embedded Technologies e.V. (SGET), held on June 08, the new management board was [...]
SGET team SDT.01 finalized new Design Guide 2.1.1 for the SMARC modules
Munich, Germany, 5 May 2021: SGeT, the Standards Group for Embedded Technologies e.V., updated the design Guide for its famous SMARC modules to offer carrier board design guidance for the new features and interfaces of the recently released specification update. As one of the major changes in the new specification was the allowance for SERDES signaling over the last two PCIe lanes, it shows now for easy understanding a GBE [...]
New milestone in miniaturization: From credit card to postage stamp
Munich, Germany, 8. December 2020: SGET e.V. – a technical consortium hosting and developing specifications for embedded computer technology – announces release 1.0 of the new OSM™ Computer-on-Module standard. OSM™, which is short for Open Standard Module™, defines one of the first standards for directly solderable and scalable embedded computer modules. It also marks a new milestone in the miniaturization of modular COM/carrier designs, replacing credit card-sized modules with postage stamp-sized [...]
New President for SGET e.V.
Munich, Germany, 28 September, 2020: The SGET e.V., a technical consortium hosting and developing specifications for embedded computer technology, announces a change in the management of the organization. Wolfgang Eisenbarth, founding member of SGET and president since 2017, retires from his position for personal reasons. During his time in office, the SGET has grown to 47 member companies and 5 active working groups. The complete SGET management would like to [...]
SMARC module 2.1.1 specification released today
The SDT.01 released today the SMARC module specification in Version 2.1.1. It is a minor release that fixes one issue that was recently found in SMARC 2.1 specification. You can download SMARC module 2.1.1 specification directly from our SMARC module site.
SGeT enhances COM module specification for SMARC 2.1
SGeT, the Standards Group for Embedded Technologies e.V., updated the specification for its famous SMARC modules to support new features and interfaces while maintaining full backward compatibility to the previous version. One of the major changes is to alternatively allow for SERDES signaling over the last two PCIe lanes. This will allow to add two extra ethernet ports or to connect high speed sensor data as proposed by the automotive [...]
SMARC module 2.1 release
The updated SMARC module specification Rev 2.1 was released March 23, 2020. It’s fully backward compatible to Rev. 2.0 and introduces some new functions. Changes from Rev. 2.0 to 2.1: Incorporated Errata 1.1 Rev. 2 (2/9/2017) Updated signal tables Added pin number Added power domain Updated content Added termination information Added details for eDP[0:1]_HPD Added SERDES as alternative function for PCIeC and PCIeD Added MDIO Interface Updated power domains and power [...]