
Manufacturer:
nVent SCHROFF
Standard:
embeddec NUC
Schroff Interscale C case
Total conduction cooling solution
– Compatible with the Flexible Heat Conductor (FHC) for 10%-20% greater thermal dissipation than traditional conduction cooling
– The integrated springs within the FHC allow the aluminum block to expand and contract vertically thereby eliminating the need for a thermal gap pad
– Interscale C, with the FHC, provide consistent performance over the lifetime of the system
– Complies with the requirements for “top side cooling” per the SDT.03 embeddedNUC TM standard
– Whitepaper, including thermal test procedures and results, available