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NXP i.MX 8ULP ARM Cortex-A35 / M33

NXP i.MX 8ULP ARM Cortex-A35 / M33

The flexible MSC SM2S-IMX8ULP SMARC 2.1.2 module family is highly scalable and equipped with i.MX 8ULP Crossover Applications Processor that brings ultra-low-power processing and advanced integrated security with EdgeLock secure enclave to the intelligent edge. The i.MX8ULP family features up to two ARM Cortex-A35 running at 1 GHz, an ARM Cortex-M33 core, 3D/2D Graphics Processing Units (GPUs) and a Tensilica Hifi 4 DSP and Fusion DSP for low-power audio/voice and edge AI/ML processing.

The MSC SM2S-IMX8ULP module integrates the processor and low-power LPDDR4 memory technology, combined with up to 256GB eMMC Flash memory. Various interfaces for embedded applications such as Ethernet, USB 2.0, CAN-FD, dual-channel LVDS or MIPI DSI and MIPI CSI for connecting a camera are available. The thermal design power (TDP) of the module ranges from 1 to 3 W depending on used power mode.

The module is compliant with the new SMARC 2.1.1 standard, allowing easy integration with SMARC baseboards. For evaluation and design-in of the
SM2S-IMX8ULP module, MSC provides a development platform and a starter kit. Support for Linux is available (Microsoft Azure Sphere and Android support available on request).

  • Single or Dual core ARM Cortex-A35 Applications Processor up to 1.0GHz
  • ARM Cortex-M33 Real Time Processor up to 216MHz
  • Tensilica Hifi 4 DSP at 600MHz
  • Tensilica Fusion DSP at 200MHz
  • Vivante multimedia 2D/3D Graphics Processor
  • Up to 2GB LPDDR4x SDRAM at 2400 MT/s
  • Up to 256GB eMMC Flash
  • Dual-channel LVDS / MIPI-DSI x4 (optional)
  • MIPI CSI-2 Camera Interface
  • Up to 4x USB 2.0 Host interface
  • 1x USB 2.0 Host/Device interface
  • 1x 10/100 Mbit Ethernet
  • Wireless Module (optional)
  • 1x MMC/SD/SDIO interface
  • 1x CAN-FD Interface
  • 2x I2S Audio Interface
  • 14x GPIO
  • UART, SPI, I2C
  • SMARC 2.1.1 Compliant
  • Optimized design for Ultra Low Power applications and high volume at low cost