oHFM

SDT.06: Open Harmonized FPGA Module (oHFM)

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Open Harmonized FPGA Module (oHFM) // SDT.06

The Open Harmonized FPGA Module (oHFM™) is the world’s first open standard specifically designed for FPGA and SOC-FPGA modules. It addresses the common challenges of proprietary designs and vendor lock-in by providing a unified, scalable architecture for professional FPGA development.

The Concept: One Standard, Two Flavours

The oHFM standard is built on shared principles and a common signal language, yet it respects the different physical requirements of FPGA projects. It provides two harmonized variants that are not plug-and-play interchangeable but follow the same system thinking:

  • oHFM.s (Solderable): Optimized for compact, cost-efficient series production
  • oHFM.c (Connector-based): Designed for high-speed performance, scalability, and easy upgrades

Whether you are shipping 100 units or 100,000, oHFM provides the professional foundation for your next FPGA project.

Key Features & Advantages

oHFM offers a range of benefits designed to streamline the lifecycle of FPGA-based products:

  • Modular by Design
    Scales from compact embedded systems to high-performance platforms
  • Vendor Neutral
    Avoids vendor lock-in and works across major ecosystems
  • Smart Design Rules
    Features harmonized signals and scalable footprints to simplify board design
  • Faster Time-to-Market
    Uses ready-to-use building blocks and clear design rules to reduce engineering time
  • Built for the Long Run
    Inspired by more than 14 years of SMARC Module® evolution, ensuring a stable and growing ecosystem

oHFM.s: The Solderable Standard

The solderable variant (oHFM.s) is designed for high-volume production and final products where cost and space efficiency are paramount. It features four distinct sizes to accommodate different FPGA classes:

  • Size S: Designed for entry-level FPGAs
  • Size M, L, and XL: Scalable footprints that adapt to increasing signal complexity
  • Mechanical Stability: Excellent for harsh environments due to direct PCB soldering
  • Manufacturing: Enables lean, connector-less manufacturing processes
oHFM.s: Solderable Module Variant of the Open Harmonized FPGA Module Standard with 4 different sizes (S, M, L, XL)

oHFM.c: Performance Without Compromise

The connector-based variant (oHFM.c) is tailored for mid- to high-end FPGAs requiring high I/O counts and high-speed interfaces.

  • High Pin Density: Offers from 332 up to 1200+ pins across different form factors
  • Scalability: Multiple mechanical outlines depending on I/O and power requirements
  • Versatility: Ideal for prototyping, evaluation, and in-field hardware upgrades
  • Thermal Management: Built to support serious cooling concepts for power-intensive applications
oHFM.c: Connector-based Module Variant of the Open Harmonized FPGA Module Standard with 4 different sizes (S, M, L, XL)

A Collaborative Industry Effort

oHFM was developed by a growing community of experts, vendors, and system architects within SGET. This standard is the result of a broad collaboration between leading silicon manufacturers, module providers, and systems integrators. It also incorporates the expertise of academic research institutions and software specialists to ensure a comprehensive, field-proven, and future-proof architecture.

If you are interested in more detailed information, we recommend downloading the specification.