• Manufacturer:

    Tria Technologies

  • Type:

    Computer-on-Module

  • Type:

    Size-M

  • Standard:

    OSM

The TRIA OSM-MF-IMX952 is based on the OSM 1.2 standard (Size-M, Medium), a specification for fully solderable embedded computer modules designed for automated manufacturing, assembly and testing.

The TRIA OSM-MF-IMX952 is based on the OSM 1.2 standard (Size-M, Medium), a specification for fully solderable embedded computer modules designed for automated manufacturing, assembly and testing.

Powered by the NXP i.MX 952 processor family, the module provides an attractive combination of performance, energy efficiency and industrial-grade reliability. The processor architecture combines application processing, real-time capabilities and advanced multimedia support, making the module suitable for industrial control systems, operator terminals, gateways and intelligent connected devices.

TRIA OSM-MF-IMX952 integrates high-performance LPDDR5 memory, eMMC flash storage and a versatile set of interfaces including Gigabit Ethernet, USB, PCI Express®, CAN-FD, LVDS, MIPI-DSI and MIPI-CSI. This makes the module suitable for applications requiring connectivity, multimedia support and long-term availability.

The compact OSM-M footprint and fully single-sided assembly eliminate the need for carrier board cut-outs, simplifying PCB design and providing an attractive migration path from existing designs based on earlier processor generations.

The module is fully pin-compatible with the TRIA OSM-MF-IMX937 and a gen-to-gen upgrade for TRIA OSM-MF-IMX8PLUS, enabling a scalable product strategy based on a single carrier board design.

A Yocto-based Linux Board Support Package is available, Android on request.

Development Platform Available
For evaluation, software development and proof-of-concept creation, TRIA provides the OSM-SB-EP5 development platform. The platform supports interface validation, application development and wireless connectivity evaluation via the integrated M.2 expansion slot, while also serving as an ideal starting point for project-specific carrier board development.

  • Quad/Dual core Arm Cortex-A55 with 1.7GHz
  • ARM Cortex-M7 Real Time Processor at 800MHz
  • Arm Cortex-M33 Real Time Processor at 333MHz
  • NXP eIQ Neutron Neural Processing Unit.
  • NXP Image Signal Processor
  • Arm Mali Graphics Processing Unit
  • Video Processing Unit up to 4k decode/encode
  • Up to 16GB LPDDR5 SDRAM with inline ECC
  • Up to 256GB eMMC Flash
  • Dual-channel LVDS / MIPI-DSI x4
  • MIPI CSI-2 Camera interface
  • 1x PCI Express x1 Gen. 3
  • 2x USB 2.0 Host/Device interface
  • 2x Gigabit Ethernet (RGMII)
  • 3x CAN-FD Interface, 2x SDIO interface
  • 2x I2S Audio Interface
  • 24x GPIO, 6x ADC, 4x PWM
  • UART, SPI, QSPI, I2C
2026-11-02T17:25:52+01:00