• Manufacturer:

    Tria Technologies

  • Type:

    Computer-on-Module

  • Standard:

    OSM

The TRIA OSM-LF-IQ615 is based on the new OSM 1.2 standard (Size-M) “Medium” for completely machine processible low-cost embedded computer modules during soldering, assembly, and testing.

The TRIA OSM-LF-IQ615 is based on the OSM 1.2 standard (Size-L) “Large” and is powered by the Dragonwing IQ-615 Processor from Qualcomm. It is a low-cost embedded computer modules completely machine processible during soldering, assembly and testing.

The processors integrates 8 ARM Cores (2x A76 + 6xA55 Arm Cortex cores) and a powerful Adreno 612 GPU, bringing performance and energy efficiency to Linux-based edge applications. The Hexagon™ V66 DSP with Dual hexagon Vector, enabling developers to create more capable, cost-effective and energy-efficient machine learning (ML) applications. The IQ-615 processors deliver advanced security with Secure boot, secure debug, TrustZone, Qualcomm® Trusted Execution Environment and hardware supported KeyStore.

TRIA OSM-LF-IQ615 provides fast and low power LPDDR4 memory technology, combined with up to 256GB eMMC Flash memory. Various interfaces for embedded applications such as Gigabit Ethernet (RGMII), USB 2.0/3.1, DP v1.4, MIPI-DSI and MIPI CSI-2 (4-lane) for connecting a camera are available.

The module is compliant with the OSM 1.2 standard (OSM-SL). For evaluation and design-in of the TRIA OSM-LF-IQ615 module, Tria Technologies provides a development platform and a starter kit. A Yocto based Linux Board Support Package is available.

  • Octal Core CPU powered by the Dragonwing IQ-615 Processor from QualcommDual core Arm Cortex-A76 up to 1.9GHzAnd hexa core Arm Cortex-A55 up to 1.6GHz
  • And hexa core Arm Cortex-A55 up to 1.6GHz
  • Adreno 612 GPU
  • Hexagon™ V66 DSP with Dual hexagon Vector (1.1 TOPs)
  • Spectra™ 230 image processing engine (ISP)
  • Adreno 443 VPU Video Decode/Encode 4k60(D)/1k60/(E)
  • Up to 8GB LPDDR4x SDRAM 3110MT/s
  • Up to 256GB eMMC Flash
  • 1x UFS 2.1, 1x SDIO
  • 1x USB 2.0, 1x USB 3.1
  • 1x PCIe Gen2
  • MIPI-DSI, 1x DP v.1.4 (up to 4 Displays)
  • 3x MIPI-CSI (4lane up to 4 cameras)
  • 1x Ethernet (RGMII) up to 1 Gbps
  • 4x UART, 2x SPI, 1x QSPI, 6x I2C, 2x I2S Audio
  • Yocto Linux, Ubuntu (on request)
  • Optimized design for low cost and low power applications
  • OSM Size-L – “Large”: 45 mm x 45 mm / with 662 contacts
  • Dual core Arm Cortex-A76 up to 1.9GHz
2026-04-08T12:55:46+02:00