TRIA OSM-LF-IMX952

The TRIA OSM-LF-IMX952 is based on the OSM 1.2 standard (Size-L, Large), a specification for fully solderable embedded computer modules optimized for automated assembly, reflow soldering and manufacturing processes.

Highly scalable and equipped with NXP’s i.MX 952 applications processor family, the module delivers an excellent balance between performance, power efficiency and system cost. The processor integrates Arm® Cortex®-A55 application cores, dedicated Arm® Cortex®-M33 real-time processing capabilities, advanced graphics acceleration and comprehensive industrial connectivity, making it well suited for industrial HMI, automation, building control and connected edge applications.

TRIA OSM-LF-IMX952 combines high-bandwidth LPDDR5 memory technology with integrated eMMC flash storage and supports a broad range of high-speed interfaces. Available interfaces include Gigabit Ethernet, USB, PCI Express®, CAN-FD, LVDS, MIPI-DSI and MIPI-CSI, enabling flexible system integration for display, networking and vision-based applications.

The module is pin-compatible with the TRIA OSM-LF-IMX95 and TRIA OSM-LF-IMX937, allowing developers to scale performance and system cost while maintaining a common carrier board and system design.

A Yocto-based Linux Board Support Package is available, Android on request.

Development Platform Available
For evaluation, software development and proof-of-concept creation, TRIA provides the OSM-SB-EP5 development platform. The platform supports interface validation, application development and wireless connectivity evaluation via the integrated M.2 expansion slot, while also serving as an ideal starting point for project-specific carrier board development.

• Quad/Dual core Arm Cortex-A55 with 1.7GHz
• Arm Cortex-M7 Real Time Processor at 800MHz
• Arm Cortex-M33 Real Time Processor at 333MHz
• NXP eIQ Neutron Neural Processing Unit
• NXP Image Signal Processor
• Arm Mali Graphics Processing Unit
• Video Processing Unit up to 4k decode/encode
• Up to 16GB LPDDR5 SDRAM with inline ECC
• Up to 256GB eMMC Flash
• Dual-channel LVDS, MIPI-DSI x4
• MIPI CSI-2 Camera Interface
• 1x PCI Express x1 Gen. 3
• 2x USB 2.0 Host/Device interface
• 2x Gigabit Ethernet (RGMII)
• 3x CAN-FD Interface, 2x SDIO interface
• 2x I2S Audio Interface
• 24x GPIO, 6x ADC, 4x PWM
• UART, SPI, QSPI, I2C