Manufacturer:
ADLINK Technology, Inc.
Type:
Computer-on-Module
Standard:
OSM
OSM Size-L R1.1 Module with NXP i.MX 93 dual core Arm Cortex-A55 & M33 SoC with an in-SoC microNPU
The module is made for edge solutions needing on-device AI processing at ultra-low power. The OSM-IMX93 module supports LVDS and DSI graphics output, 2x GbE (1 TSN capable), 2x CAN bus, I2S audio codec interface, USB2 interfaces, and provides 15-year product availability.
Specifications
- NXP i.MX93 with dual core Arm Cortex-A55 & M33
- In-SoC Arm Ethos-U65 microNPU
- OSM revision 1.1 compliant
- LVDS, DSI graphic output interfaces
- CSI, Dual CAN bus / USB 2.0 / USB 3.0 interfaces
- Dual GbE ports (one TSN capable)
- I2S audio codec interface
- Extreme rugged support: -40°C to +85°C (optional)
- Up to 15 years product availability