Manufacturer:
Tria Technologies
Type:
Computer-on-Module
Standard:
Qseven
The new MSC Q7-EL module features Intel’s next-generation low-power, multi-core system-on-chip (SOC) Atom generation (codenamed “Elkhart Lake”). Built on 10nm process technology the SoC integrates the next generation Intel Atom processor core architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The module is designed for extended temperature range and 24/7 operation making it an ideal platform for mission critical tasks that require a reliable and performant compute base. It provides significant performance gains over previous Atom generations allowing for technology upgrades within existing power and cooling requirements defined by the system design.
The new MSC Q7-EL offers triple independent display support with a maximum of 4k resolution, DirectX 12, fast LPDDR4 memory with up to 16GB and optional IBECC capabilities, fast UFS 2.0, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient Q7 module. Different SOCs with dual- and quad-core processors are supported by this design. In addition to an extensive set of interfaces and features, the MSC Q7-EL offers 1 Gigabit Ethernet with Time-Sensitive Networking (TSN) and 1 CAN-FD interface. For evaluation and design-in of the MSC Q7-EL module, MSC provides a suitable Q7 2.1 development platform. A complete, ready-to-run Starterkit is also available.