• Manufacturer:

    iWave Global

  • Type:

    FPGA-on-Module

  • Type:

    Size-S

  • Standard:

    oHFM.c

iG-G74M: Kintex™ UltraScale+™ FPGA System on Module

iWave’s Kintex UltraScale FPGA System on Module is a high-performance FPGA computing platform designed for bandwidth-intensive and compute-demanding embedded applications. Built on AMD/Xilinx Kintex UltraScale and UltraScale+ FPGA architecture, the SoM combines powerful programmable logic, high-speed transceivers, and integrated processing capabilities in a compact and scalable form factor. The module supports advanced connectivity, high memory bandwidth, and extensive I/O expansion, enabling accelerated development for applications requiring real-time performance.

Specifications

SoC

  • Compatible with KU5P/KU3P
  • Up to 474K Logic cells & 216K LUTs
  • GTY Transceivers x 16 @32.75Gbps
  • 72 LVDS IOs / 144 SE IOs from HP Bank and 66 SE IOs from HD Bank

Memory & Storage

  • 16-bit 2GB-DDR4
  • 256MB QSPI Flash
  • 2Kb EEPROM

PMIC

Dialog’s DA9062 PMIC with RTC

Clock

Clock Synthesizer

Board to Board Connector1 Interfaces(320pin)

  • 4 channels of GTY transceivers up to 32.75Gbps
  • 24LVDS/48SE IOs from HP-BANK 64
  • 18SE IOs from HD-BANK 87
  • 24SE IOs from HD-BANK 86
  • 24SE IOs from HD-BANK 84
  • JTAG
  • SYSMON_DXP/DXN, UART, I2C

Board to Board Connector2 Interfaces(320pin)

  • 12 channels of GTY transceivers up to 32.75Gbps
  • 24LVDS/48SE IOs Pairs from HP-BANK 65
  • 24LVDS/48SE IOs Pairs from HP-BANK 66

BSP Support

BareMetal BSP

General Features           

Power Input: 12V through B2B Connector1 & 2

Form Factor: 50mm x 75mm [Open Harmonized FPGA Module (oHFM.c – Size S)]

Operating Temperature: -40°C to +85°C (Industrial Grade)

Environment Specification: REACH & RoHS3 Compliant

Compliance: CE*

2026-07-06T10:09:20+02:00