Manufacturer:
iWave Global
Type:
FPGA-on-Module
Type:
Size-S
Standard:
oHFM.c
iWave’s Artix UltraScale+ FPGA System on Module is a compact, high-performance FPGA platform designed for power-efficient embedded computing and highspeed interface applications. Built on AMD/Xilinx Artix UltraScale+ FPGA architecture, the module delivers an optimal balance of logic density, low power consumption, and high-speed connectivity for next generation embedded designs. The SoM integrates programmable FPGA logic, highspeed GTY transceivers, onboard DDR4 memory, and rich I/O support within a compact oHFM form factor.
Specifications
SoC
- Compatible with AU25P / AU20P / AU15P / AU10P
- Up to 308K Logic cells & 141K LUTs
- GTY Transceivers x 12 @16.375Gbps
- 72 LVDS IOs / 144 SE IOs from HP Bank and 66 SE IOs from HD Bank
Memory & Storage
- 16-bit 2GB-DDR4 (supports only AU25P)
- 256MB QSPI Flash
- 2Kb EEPROM
PMIC
Dialog DA9062 PMIC with RTC
Clock
Clock Synthesizer
Board to Board Connector1 Interfaces(320pin)
- EEPROM
- 4 channels of GTY transceivers up to 16.375Gbps
- 24LVDS/48SE IOs from HP-BANK 64
- 18SE IOs from HD-BANK 87
- 24SE IOs from HD-BANK 86
- 24SE IOs from HD-BANK 84
- JTAG
- SYSMON_DXP/DXN, UART, I2C
Board to Board Connector2 Interfaces(320pin)
- 8 channels of GTY transceivers up to 16.375Gbps
- 24LVDS/48SE IOs Pairs from HP-BANK 65
- 24LVDS/48SE IOs Pairs from HP-BANK 66
BSP Support
BareMetal BSP
General Features
Power Input: 12V through B2B Connector1 & 2
Form Factor: 50mm x 75mm [Open Harmonized FPGA Module (oHFM.c – Size S)]
Operating Temperature: -40°C to +85°C (Industrial Grade)
Environment Specification: REACH & RoHS3 Compliant
Compliance: CE*