Munich, May 2022 – SGET announces two important innovations for its solder-on module standard, which was launched in 2019: On the one hand, the new specification in version 1.1 with many backward-compatible improvements and future-proof extensions. And on the other hand, the first design guide with practical tips and information on the design-in of OSM modules.

With the Open Standard Module (OSM) standard published in 2021, the Standardization Group for Embedded Technologies e.V. (SGET) has hit a nerve in the embedded scene. This is reflected in the rapid further development, as the new specification 1.1 shows. Martin Steger, Chairman of the Standard Development Team (SDT), which is responsible for the OSM modules, looks positively into the future: “The hard work of the past months has paid off. With the results now published, OSM will establish itself as the world’s first open, multi-vendor and scalable standard for solder-on modules.” The standardization team around Steger had already caused a stir with the first version of the Open Standard Module.

A development like this is only possible through intensive cooperation and the closest exchange at the highest level. This is also emphasized by Ansgar Hein, Chairman of SGET: “Our goal as SGET is to provide a space for the development of open standards and to bring together the best experts internationally for the relevant topics.” In the past, this has already been successfully achieved several times with commercially successful standards such as SMARC and Qseven.

The newly presented design guide in particular offers developers and integrators important approaches for designing open standard modules into their own boards. Baseboard developers benefit from the synergies within SGET, where bridges are already being built between semiconductor manufacturers, integrators and users within the standard development teams. “The increasing requirements in terms of growing productivity and more powerful applications with maximum flexibility can be brought to the market quickly and efficiently by means of standardized OSM modules,” says Martin Steger. But that’s not all, because with the newly presented release and the improvements and extensions it contains, a lifecycle of more than ten years is assured for the OSM form factor.

Both the new design guide as version 1.0 and version 1.1 of the specification can be downloaded free of charge from the SGET website.

SGET e.V. is a registered technical, scientific and educational not-for-profit association organized under German law with its registered office in Munich. The purpose of the Association is the promotion of science, technology and research for the benefit of society and humanity. Embedded computing companies, board or system level manufacturers, semiconductor and connector manufacturers, software developers, research and educational institutions as well as embedded system integrators, OEM solution providers and industrial users, are welcome to join the SGET e.V. and contribute their ideas.

Contact:

Standardization Group for Embedded Technologies e.V.
Julius-Haerlin-Straße 21
82131 Gauting

Tel. +49 (89) 21529788
E-Mail: info@sget.org
Internet: www.sget.org