Manufacturer:
ADLINK Technology, Inc.
Type:
Computer-on-Module
Standard:
OSM
The ADLINK OSM-MTK520 is a high-performance OSM R1.2 Size-L module engineered to accelerate sophisticated edge AI deployments through the advanced MediaTek Genio 520 series processor. By combining a dual-core Arm Cortex-A78 with a hexa-core Cortex-A55, this module leverages an integrated 8th Gen NPU engine to deliver up to 10 TOPS of AI compute power while maintaining ultra-low power consumption. Its solderable, connector-less BGA design ensures maximum mechanical stability and streamlined SMT production, making it an ideal choice for ruggedized “Physical AI” applications and autonomous systems.
This versatile platform offers extensive multimedia and connectivity features, including support for DP, eDP, MIPI-DSI, and LVDS graphic outputs alongside a robust I/O suite featuring GbE with TSN support, USB 3.1, and 18x GPIO. Designed for mission-critical reliability, the OSM-MTK520 includes an integrated security island and is available in rugged operating temperature variants ranging from -40°C to 85°C.
Specifications
- MediaTek Genio 520 series processor with 2x Arm Cortex A78 and 6x Arm Cortex A55
- SGeT OSM R1.2 compliant, Size-L module (45mm x 45mm)
- Integrated 8th Gen MediaTek NPU delivers up to 10 TOPS
- Up to 16GB LPDDR5 memory, up to 256GB UFS storage
- DP, eDP, MIPI-DSI and LVDS display options, 2x MIPI-CSI 4-lanes
- GbE LAN + TSN, USB 3.1, UART, SPI, I2S, I2C, and GPIO
- Industrial temperature: -40°C to +85°C (optional)
- 10 years product availability10 years product availability