Manufacturer:
Tessolve Semiconductor Pvt. Ltd.
Type:
Carrier Board
Standard:
SMARC
NXP S32G2 Application board + SMARC Module
High-performance application board based on S32G274 SMARC SoM targeted for vehicle networking and industrial applications.
Specifications
- Wireless Connectivity: Wi-Fi 6 or 5G/LTE
– M.2 (B Keys) Connector over PCIe (5G) or USB (LTE)
– M.2 (A+E Keys) Connector for Wi-Fi 6 Connectivity
- AI or Storage:
– AI Acceleration: M.2 (A+E Keys) Connector or
– NVMe Storage: M.2 (M Keys) Connector for NVMe SSD
- GNSS module supporting GPS + GLONASS and IMU 6 Axis Sensor
- Automotive Load Dump Protection with 6V to 36V wide supply
- Multiple network interfaces, featuring,
– 6x CAN, 2x Flex CAN
– 2x GbE Ports
– 3x USB 2.0 supported through Hub
• Temperature range : -40°C to +105°C