SGET, the Standardization Group for Embedded Technologies e.V., has released its 2.1 version of the Qseven standard.
“Qseven has been well established as a multi-platform standard over the last couple of years. Our strength is that we carry on being compatible to our earlier versions”, summarizes Engelbert Hörmannsdorfer, Chairman of the SGET e.V. “Thorough simulations made by our member Iriso and performed by simulation specialist EyeKnowHow proved that Iriso’s long-time-available MXM2 connector is fully PCI Express Gen3 capable. This enables Qseven users to fully benefit of latest hardware generations running at transfer speeds of up to 8 GT/s (gigatransactions per second and lane) without limitations.” Additionally version 2.1 defines one more USB SuperSpeed port, an extra interrupt capable GPIO Port and it reserves so far unneeded power pins for future features in later releases.
Qseven is a well-established, legacy-free standard for technology-independent small form factor computer modules (COMs) which includes standardized thermal/mechanical interfaces. It has been well adopted in the market and supports x86 and ARM technologies in COM-compatible environments. For developers of small form factor devices this is a strategic and cost saving benefit, as the decision for one or the other hardware does not affect the mechanical design of the devices. This enables risk-free changes between the platforms and a wider scalability by means of cost, performance and specific features.
The updated Qseven specification Version 2.1 will be freely available for download on the SGET website according to the SGET terms of membership – both for Qseven developers as well as for users and carrier providers. Supported processor platforms for Qseven include ARM technology from Nvidia, Freescale and Texas Instruments as well as x86 technology from Intel and AMD.
Other companies in the embedded computing industry are invited to join the SGET e.V. and contribute their ideas. Apart from embedded computing manufacturers on board and system level, also chip and connector manufacturers, research and educational institutions as well as embedded system integrators, OEM solution providers and industrial users are most welcome.