Please join our working group to form with us together this new upcoming module standard. There still time to join in!
SDT.05: Open Standard Module™
The constantly growing quantities and the increasing efforts for miniaturisation, cost optimisation and modularisation, in conjunction with increasingly powerful low-cost computer platforms, make the development of a new form factor for solder-down modules appear to be sensible and necessary.
As one of the most important standardization bodies for embedded computer technology worldwide, SGET must play a leading role in this field of technology and be able to publish the results of its members in a forward-looking specification as quickly as possible.
As the most important key data and requirements for the new standard, the following features were written down as a result during the SGET workshop on 5 June
2019 in Munich:
In order to shorten the development time for the new standard, the initial founding members Kontron AG, F&S Elektronik Systeme GmbH and iesy GmbH & Co. KG decided to work out a preliminary specification in advance. The proposed preliminary specification will be available on request.
The initial founding members decided to call any solder-down module derived from the new standard “Open Standard Module™” as working name with the following logo proposal:
For these reasons, SGET calls-for-participation in the new SDT.05 on all its members to join the new Standardization Development Team.
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