SGET: Call for new Working Group
Initial SDT.05 Meeting: 1st of October 2019, 14:00 CEST
Scope
The constantly growing quantities and the increasing efforts for miniaturisation, cost optimisation and modularisation, in conjunction with increasingly powerful low-cost computer platforms, make the development of a new form factor for solder-down modules appear to be sensible and necessary.
As one of the most important standardization bodies for embedded computer technology worldwide, SGET must play a leading role in this field of technology and be able to publish the results of its members in a forward-looking specification as quickly as possible.
As the most important key data and requirements for the new standard, the following features were written down as a result during the SGET workshop on 5 June
2019 in Munich:
1) Standardization needed for
Mechanical Dimensions
Pinout / Interface
RF Interfaces
Cooling Solutions
Power Dissipation
2) Focus on
Scalability
Processibility (fully automatable)
Testability
Tracebility
Serviceability
Certification Capabilities
3) Key Benefits
Miniaturization
Modularization
Cost Reduction
Second Sourcing
Increased Customer Confidence
Easy Integration
In order to shorten the development time for the new standard, the initial founding members Kontron AG, F&S Elektronik Systeme GmbH and iesy GmbH & Co. KG decided to work out a preliminary specification in advance. The proposed preliminary specification will be available on request.
The initial founding members decided to call any solder-down module derived from the new standard “Open Standard Module™” as working name with the following logo proposal:
For these reasons, SGET calls-for-participation in the new SDT.05 on all its members to join the new Standardization Development Team.
If you like and want to get in contact with us, please send us your request:

